| 摘要 |
PURPOSE:To regulate the positions of outer leads positively, and to enable automatic mounting to a substrate by arranging the outer leads among protruding sections, melting the protruding sections and fixing the outer leads to a case material. CONSTITUTION:A case material 6 to which protruding sections 5 to the pitches of outer leads 2 are shaped are fastened to a hybrid integrated circuit substrate 1 by using an adhesive sheet, and approximately the intermediate sections of the outer leads 2 are bent at right angles and the outer leads 2 are inserted and disposed among the protruding sections 5 for the case material 6. The case material 6 is formed with an insulating resin such as an epoxy resin, and composed of a sealing box section 7, to space of which a circuit section shaped by a circuit element 3 formed onto the hybrid integrated circuit substrate 1 is shaped and which hermetically seals the circuit section, and guide sections 8 unified with the sealing box section 7 and projected and formed from the hybrid integrated circuit substrate 1, and the protruding sections 5 corresponding to the pitches of the outer leads 2 are shaped at the nose sections of the guide sections 8. The outer leads 2 are disposed among the protruding sections 5, metallic trowels 9 heated at a high temperature are abutted against the protruding sections 5, the protruding sections 5 are melted, and the outer leads 2 are fixed to the guide sections 8 for the case material 6 and unified.
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