| 摘要 |
PURPOSE:To prevent the erroneous recognition of detection due to a photo sensor by a method wherein light-shielding pads are formed on parts, whereon there exists no metal wiring pattern, of an insulating film and holes, which penetrate the insulative film, are provided on these light-shielding pad regions. CONSTITUTION:A metal pad 8 is provided for discriminating the good or bad of an IC and a penetrating hole 9a is bored therein. The size of a pad free from on errors of detection has only to be a square of 2 mm square or more to the size of a hole of a diameter of 1 mm. Moreover, a hole can be bored on part of a wiring pattern like 9bs. In this case, pads 6 are formed in a largish size and an electric test can be conducted even after a hole is bored on the pads. In case the color of an insulative film 1 is comparatively deep, the whole periphery of each hole is not covered with a metal, but a part only thereof can be covered with a metal. As mentioned above, a detection which is executed by a photo sensor can be reliably performed by the presence or absence of holes bored on a tape carrier and a mistake that a non-detective is removed and a defective is handled as a non-defective is eliminated.
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