| 摘要 |
Compounds of formula I or II <IMAGE> (I) <IMAGE> (II) <IMAGE> +TR <IMAGE> in which formulae R1 and R2 are each independently of the other hydrogen, alkyl, alkenylmethyl, cyclohexyl, phenyl, benzyl or tolyl, or are a -CH2CHR3-CH2-S-H group, R3 and R4 are each independently of the other hydrogen or methyl, X is alkylene, -S-, -SO-, -SO2- or substituted alkylene, R5 and R6 are each independently of the other hydrogen or alkyl, R8 is hydrogen, alkyl, alkenylmethyl or phenyl, and wherein n is an integer from 1 to 10, can be used as hardeners for epoxy resins. The compositions containing epoxy resins and these hardeners are particularly suitable for use as adhesive formulations. The cured products have good moisture resistance. |
