| 摘要 |
PURPOSE:To easily enable the accurate positioning of the leads and pads without affecting the wiring design of a printed circuit board even for surface attaching components having a narrow lead pitch, by patterning the pads for lead connection with a substantially same size as the leads. CONSTITUTION:Pads 4 for connecting the leads of a printed circuit board are formed at a level lower than an insulator 5 on the surface of the printed circuit board itself so that they are exposed with a size slightly larger than the bonding surface of leads 2. Thus, if, after applying a treatment such as a solder paste onto the lead connection pads 4, the leads 2 are fitted, the accurate positioning can easily be made and a solder 3 is fused, whereby the pads 4 and the leads 2 are connected. Also, the lines 6 provided between the pads 4 are covered with the insulator 5 when they are formed, whereby the bridge short of the solder is prevented.
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