| 摘要 |
PURPOSE:To improve the adhesive strength of a plated film and to relieve the control of an etching soln. by incorporating fine metal particles which dissolve readily in the etching soln. into a resin core when the core is subjected to electroless plating after the surface is pretreated by etching. CONSTITUTION:Conventional resin for plating such as ABS resin, PP resin or polycarbonate resin is mixed with about 1% fine copper particles of <=1mum particle size and molded into a resin core. The exposed copper particles on the surface of the resin core are dissolved by chromic acid in an etching soln. in an etching stage to make the surface of the core uneven. Since the copper particles dissolve very readily in the etching soln., satisfactory surface roughening is carried out even when the temp. of the etching soln. is low. The surface roughening can be finished in a short time, so the control of the etching soln. can be relieved. |
