| 摘要 |
<p>An apparatus for the application of a conductive adhesive medium in a fluid state, such as solder, to the side printed with circuitry of a board (K) bearing electronic components, said apparatus consisting substantially of a hollow shaft (2) standing in a supply tank (1) for the adhesive medium, and an obliquely rising conveyor belt (3) for one circuit board (K) at a time, wherein the upper end of the hollow shaft (2) possesses two overflow edges arranged perpendicular to the direction of transport for the formation of a wave, through the crest of which the side of the board (K), previously moistened with a flux, is passed, and wherein near the leading overflow edge with respect to the direction of transportation, an adjustable damming means (12) is arranged for the temporary raising of the fluid level, so obtaining an asymmetrical wave pattern. Owing to the damming means at the front of the shaft, an asymmetrical wave pattern is achieved.</p> |
