| 摘要 |
PURPOSE:To evaluate the corrosiveness of sealing resin accurately by a method wherein the cured sealing resin is ground and, after pure water is added to it, put in a pressure cooker to extract impurity ions and then an aluminum wiring pattern is dipped in the extracted solution and the resistance variation of the wiring is measured. CONSTITUTION:After epoxy resin is applied to a metal plate, the resin is heated and cured. After the cured resin is peeled off and ground into particles with a certain diameter, the ground resin is mixed with pure water with a certain mixing ratio and the mixture is put in a pressure cooker to extract impurities in the resin into the pure water. A sample is formed by forming a quasi Al wiring pattern on a glass plate and the wiring part of the sample is dipped in the extracted solution. A voltage is applied between the Al wiring pattern and the impurity ions are made to discharge to the Al wiring to induce corrosion. The corrosiveness is evaluated by measuring the rate of resistance variation caused by the corrosion and by visual inspection. With this constitution, the corrosiveness of the sealing resin for a semiconductor IC can be evaluated quickly and the sealing resin compound can be selected easily.
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