| 摘要 |
PURPOSE:To level the surface of viscous liquid surely in a simple manner in which special process is not required by adding a function of blowing air against a liquid unleveled after it is discharged and also a function of a heater for heating. CONSTITUTION:At first an IC module 18 is set on a work stage 2 kept by heat at 60 deg.C and a cylinder portion 1 is moved toward a discharge position to discharge resin into a dam block 19 to which sealing is applied with resin. After that, air is blown through an air needle 17 against the resin 13 having a hemispherical shape due to surface tension after being discharged to fluidize the swelled surface of the resin by breaking the balance of surface tension thereof. By the time the cylinder 1 begins to rise after air blowing, the resin 13 in the dam block 19 is heated by means of the work stage 2 to a temperature at which the resin 13 begins to flow, so that the surface of the resin 13 is leveled uniformly and the IC chip 20 is sealed.
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