发明名称 HARD COMPOSITE ABRASIVE POWDER FOR CUTTING AND GRINDING
摘要 PURPOSE:To provide a hard composite powder having an excellent abrasion resistance and well adapted to be used as an abrasive powder in cutting and grinding, by coating the surfaces of a silicon carbide powder having a specified particle size with thin diamond films. CONSTITUTION:Diamond coating layers having an average thickness of 0.1-50mum are formed on the surfaces of a silicon carbide powder having an average particle size of 5-50mum to obtain a hard composite abrasive powder for cutting and grinding. The diamond coating layers can be formed by vapor phase synthesis using a common chemical vacuum deposition device to achieve a cost reduction.
申请公布号 JPS63284285(A) 申请公布日期 1988.11.21
申请号 JP19870118564 申请日期 1987.05.15
申请人 MITSUBISHI METAL CORP 发明人 TAMAO YOSHITAKA;KIKUCHI NORIBUMI;YAMASHITA HIROAKI;OSHIMA HIDEO
分类号 B24D3/00;C09K3/14 主分类号 B24D3/00
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