| 摘要 |
PURPOSE:To prevent lead components from dropping, to simplify soldering steps, and to place a mounting component and the lead components in mixture by inserting the leads of the component into a through hole, and then bending the end of the leads projected from the hole along the rear face of a substrate. CONSTITUTION:The lead 8 of a lead component 2 is inserted into a through hole 9 by a substrate 3, and so inserted that the end 12 of the lead 8 protrudes to the rear face 4 of the substrate. Then, the end 12 of the protruding lead 8 is so bent along the rear face 4 as to bring into contact with the lead component mount 7. Further, the substrate 3 is inverted, and a solder layer 10 is simultaneously printed on the mount 6 for mounting the electrodes 1a, 1b of a surface mounting component 1 and the mount 7 of the component 2 on the rear face 4. Thus, the layers 10 remain on the mounts 6, 7.
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