摘要 |
PURPOSE:To supply suitable amount of soldered medium to the sections of a mounting region on a substrate by supplying the medium to predetermined number of flowing holes of a head through a predetermined number of tubes from a container. CONSTITUTION:Flowing holes 70 penetrated through the cover 44b of a flux head 36 are disposed circularly at the cover, and tubes 42 connected to a flux dispenser 41 are respectively inserted into the holes 70. The drivers 40 of soldering medium supply means 5 drives the head 36 by a command from an operation unit 62 by a controller 60 to coat the mounting region 111 on a substrate 110 positioned on a base 32 with flux. Then, a driver 55 feeds an electronic component 100 on the region 111, positions the lead terminal 102 of the component 100 to the region 111, and accurately and effectively mount the component 100 on the region 111 by a heating current from a transformer 58.
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