| 摘要 |
<p>PURPOSE:To enable a chip element to be fixed and held with a substrate having a decreased thickness, by providing a lining plate so that the element provided within a hole of a circuit board is temporalily fixed by the lining plate, said lining plate being peeled off after the element is packaged. CONSTITUTION:A hole is provided in a circuit board 1 at a position where a semiconductor element 8 is to be provided, such that it is large enough to contain such element. The element 8 is connected to a circuit pattern 5 on one side of the board 1, while a lining plate 2 is adhered on the side opposite thereto for fixing and holding the element 8. The lining plate 2 is peeled off after the element is packaged by sealing it with resin. In this manner, the thickness of the board for fixing and holding the element 8 can be decreased substantially.</p> |
