| 摘要 |
PURPOSE:To prevent the generation of pinholes, pittings, etc., in a nonmagnetic layer by alternately switching the electrode potential of the electroless plating bath to the noble side and base side of a gaseous hydrogen generating potential at the time of forming the nonmagnetic layer on the surface of a substrate. CONSTITUTION:The nonmagnetic layer is formed on the substrate surface in the electroless plating bath, and the magnetic layer is then formed on the surface of the nonmagnetic layer. When the nonmagnetic layer is formed, the electrode potential of the electroless plating bath is alternately switched to the noble side and base side of the gaseous hydrogen generating potential. When the electrode potential is on the base side of the gaseous hydrogen generating potential, the nonmagnetic layer is deposited and formed, and the pinholes, pittings, etc., are filled with the freshly formed substance when the electrode potential is on the noble side of the gaseous hydrogen generating potential. The switching of the electrode potential to the noble side and base side of the gaseous hydrogen generating potential is carried out several times, and a nonmagnetic layer without any pinhole, pitting, etc., is formed on the substrate.
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