| 摘要 |
PURPOSE:To form a pattern accurately by a method wherein a metal film other than copper is formed on the surface of a thin copper sheet formed on a substrate material, a resist layer is formed on the metal film and a copper layer as the conductor pattern is then formed so that a side-etched part at the copper layer can be reduced. CONSTITUTION:Metal films 16 other than copper are formed on thin copper sheets 12 formed on a substrate material 10. Patterns of resist layers 20 composed of dry films or resist ink are formed on the metal films 16. After the metal films 16 in parts not covered with the resist layers 20 have been removed, copper layers 24 are formed by a plating operation. After the resist layers 20 have been removed and the metal films 16 have been exposed, protective films 26 composed of an organic substance which has an affinity with copper are formed on the surface of the copper layers 24. The metal films 16 not covered with the protective films 26 are removed; the thin copper sheets 12 are treated with an etching solution; conductor patterns are formed on the substrate 10. By this setup, a side-etched part at the copper layers 24 is reduced and the patterns are obtained accurately. |
