| 摘要 |
PURPOSE:To enhance the adhesive performance of a circuit pattern film to a substrate by a method wherein a retaining film retained after being impregnated with a solution is formed on the substrate and adhesion-reinforcing powders to enhance the adhesive performance of a circuit element form to the substrate body are contained in the retaining film. CONSTITUTION:A substrate for the manufacture of a hybrid IC is constituted by a substrate body 2 composed of aluminum oxide and a retaining film 3 composed of an acrylic resin coated on the surface of the substrate body. Glass powders 4 as powders to reinforce the adhesive performance are dispersed and contained in the retaining film 3. The retaining film 3 is formed in such a manner that, after the acrylic resin mixed with the powders in advance have been coated on the substrate body 2 by a spinner method or a dip method, they are dried. By this setup, the adhesive performance of a circuit pattern film to the substrate 1 is enhanced.
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