| 摘要 |
PURPOSE:To improve the efficiency of development, and to shorten the development period by forming a circuit section as a product and a development support circuit onto separate first and second semiconductor chips and connecting the first and second semiconductor chips by a package at the time of development. CONSTITUTION:A semiconductor chip 20 is arranged and fixed to a stage 31 for a multilayer ceramic package 30 and a semiconductor chip 25 to a stage 32. Each of a plurality of terminals for I/O interfaces 22-24 in the semiconductor chip 20 is wire-bonded with each of a plurality of conductors 33 formed around the stage 31 for the package 30 and each of a plurality of terminals for a development support circuit 26 in the semiconductor chip 25 with each of a plurality of conductors 34 shaped around the stage 32. A plurality of the conductors 33 connected to the I/O interfaces 23, 24 for the ceramic package 30 and a plurality of the conductors 34 connected to the development support circuit 26 corresponding to the conductors 33 are connected mutually by conductors formed among respective layer of the ceramic package 30. |
