发明名称 MULTILAYER INTERCONNECTION SUBSTRATE
摘要 PURPOSE:To prevent the generation of porous state by the effect of the fluidity of amorphous glass, reduce the rate of moisture absorption, and obtain a high insulating property, by stacking the following in order on a plurality of conductor layers formed on an insulating substrate; a first insulating layer of crystallized glass, a second insulating layer of amorphous glass, and a third insulating layer the same as the first layer. CONSTITUTION:On an insulating substrate 1, wiring conductor layer 21-28 are formed by printing and calcining silver palladium system conductor paste. Between arbitrary wiring conductor layers 24-28 required for connection, a first insulating layer 3 is formed, by printing and calcining paste of SiO2 system crystallized glass. Thereon a second insulating layer 4a is formed, by printing and drying paste type amorphous glass of SiO2 system. Thereon a third insulating layer 5 of the same quality crystallized glass as the insulating layer 3 is formed. On the insulating layer 5, a wiring conductor layer 6 is formed across the wiring layers 24-28, and resistors 7, 8 are formed at an arbitrary position so as to bridge the conductor layers 21, 22 and 26, 27, by printing and calcining terbium oxide system paste. An overcoat layer 9 is formed, by printing and calcining amorphous glass, etc., on the above-mentioned insulating layer except the end-portions of the conductor layers 21-28.
申请公布号 JPS63281499(A) 申请公布日期 1988.11.17
申请号 JP19870116551 申请日期 1987.05.13
申请人 SHARP CORP 发明人 YAMADA TAKEJI
分类号 H05K3/46 主分类号 H05K3/46
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