| 摘要 |
PURPOSE:To prevent a cathode electrode from being deleted by a cathode slide compensating plate when a semiconductor is repeatedly heated and cooled by providing at least two cathode slide compensating plates interposed between a semiconductor element and a cathode conductor, and inserting a thin plate made of soft metal between the plates. CONSTITUTION:The slide faces between a semiconductor element 10 and a cathode 16 are increased by two faces as compared with a conventional device by a cathode slide compensating plate 15a made of Mo or W and an Ag plate 18 newly added. Thus, the deformation amount of a cathode slide compensating plate plate 15 deformed by the thermal expansion or contraction of the cathode 16 due to the repeated heating and cooling steps of the device is alleviated as compared with that of the conventional device. Accordingly, the deletion of the cathode electrode 13 which has heretofore occurred is reduced. The surfaces of the plates 15, 15a are preferably smooth as much as possible, and the surfaces of the plates 15, 15a in contact with the cathode 16 and the plate 18 are desirably roll finished or lap finished with #4000.
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