| 摘要 |
<p>PURPOSE:To alleviate a thermal stress at the time of mounting a semiconductor device, to prevent resin from cracking and to improve moisture resistance by forming an island and leads in the same plane, and forming the connecting region at the end of the leads at a step higher than the lead plane. CONSTITUTION:A lead frame having an island 2 for placing a semiconductor chip 1 at its center, a plurality of leads 4 disposed radially on the same plane as that of the island 2 around the island 2, and connecting regions 5 formed with a step higher than the plane of the leads 2 at the end of the lead 4 at the side of the island 2, metal wirings 3 for connecting the electrodes of the chip 1 to the regions 5, and a resin 6 for sealing the periphery of the chip 1 including part of the leads 4 are provided. The regions 5 of the leads 4 are formed by bending the ends of the leads 4, and the surface of the region 5 is parallel to that of the island 2. Thus, this process can prevent the wiring 3 from deforming to bring into contact with the end of the island 2 and the resin from cracking due to the thermal stress at the time of soldering.</p> |
