发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a rapidly curing photosensitive resin composition giving a film with superior bonding strength and shock resistance by mixing vinyl ester resin with an acrylic monomer, acrylic modified 1,4-polybutadiene, and a photopolymn. initiator. CONSTITUTION:The desired photosensitive resin composition is obtd. by mixing vinyl ester resin (A) with an acrylic monomer (B) such as 1,6-hexanediol diacrylate, terminal acrylic modified 1,4-polybutadiene (C) represented by one of the formulae (where R is H or CH3), and a photopolymn. initiator (D) such as benzoin ethyl ether. The amount of the component C is 10-70wt% of the amount of the composition. The component C is prepd. by successively reacting 1,4- polybutadiene having hydroxyl groups at terminals with toluene diisocyanate and an acrylic monomer having a hydroxyl group such as hydroxyethyl (meth)acrylate.
申请公布号 JPS5986042(A) 申请公布日期 1984.05.18
申请号 JP19820197281 申请日期 1982.11.09
申请人 MATSUSHITA DENKO KK 发明人 MIWA AKITSUGU;NAKAMOTO ATSUHIRO
分类号 G03F7/038;G03F7/035 主分类号 G03F7/038
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