| 摘要 |
PURPOSE:To prevent the generation of a warpage and cracks on a non-magnetic substrate by a method wherein a thin striplike magnetic material is pasted on a non-magnetic substrate, and a coil is arranged on said magnetic material. CONSTITUTION:The magnetic material 12, on which amorphous [(FeNiCo)78Si8 B14] is formed in thin striplike shape, is pasted on one part of a non-magnetic substrate 10 using an organic bonding agent 11, and an insulating film 13 is formed on the non-magnetic substrate 10 containing said magnetic material 12. A pair of coils 14a and 14b in film state are formed on one part opposing to the magnetic material 12 located on the insulating film 13. Also, bonding pads 15a and 15b, connected to said coils 14a and 14b, are formed on the other part of the insulating film 13, and said bonding pads 15a and 15b are connected to the semiconductor memory of an IC card. Through these procedures, the stress of the magnetic material 12 in the interface of the non-magnetic substrate 10 can be reduced, and therefore, the generation of the warpage, the cracks and the like of the substrate 10 can be prevented.
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