发明名称 SLIDE CONTACT DEVICE
摘要 PURPOSE:To obtain the sliding contact device of low degree of abrasion, generates no heat and hardly subjected to deposition when a catalytic action is at work by a method wherein a contact material, in which a specific quantity of WC is added to Ag, is used as the sliding contact material for the thick film conductor pattern formed by sintering Ag conductor paste. CONSTITUTION:A thick resistance pattern 2 is formed on a ceramic substrate 1 by sintering resistance paste, a thick conductor pattern 3 is formed linking to said thick film resistance pattern 2 by sintering Ag conductor paste, and they are used as a wiring board 4. Opposing to the thick film conductor pattern 3 of said wiring board 4, a contact material 6 of Ag-WC of 40-80 wt.% is attached to a spring terminal material 7, and a sliding contact 5 is formed. As the contact material of said sliding contact is soft and easily slided, its contact resistance is low and stabilized, an Ag thin film conductor pattern is not worn out, there are almost no adhesion and exforiation, and an excellent contact can be obtained.
申请公布号 JPS63274109(A) 申请公布日期 1988.11.11
申请号 JP19870110319 申请日期 1987.05.06
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 FUJISHIMA SUSUMU
分类号 H01C1/12;H01C10/08;H01H1/04;H01R39/20 主分类号 H01C1/12
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