| 摘要 |
<p>PURPOSE:To perform the failure analysis while preventing the destruction of the fine internal circuit wirings by the probe needles, the offset of the probe needles and the short circuit by contact with the adjoining wirings by providing lead wirings intersecting the internal circuit wirings through an insulating film, and small pads to be connected to the lead wirings. CONSTITUTION:On a semiconductor substrate 1, an internal circuit 2 is constituted by element regions 3a-3c and circuit wirings 5a-5d connected to the element electrodes 4a-4h thereof, and a plurality of bonding pads 6 are provided which are connected to the above predetermined circuit wirings to perform the transmission of the signal with external circuits and the supply of power. On the circuit 2, lead wirings 7a-7d intersecting the wirings 5a-5d through an insulating film are formed, and in the neighborhood of the pads 6, there are formed small pads 8a-8d which are respectively connected to the wirings 7a-7d and have an area smaller than the pads 6. And with the needles 9 of a testing equipment brought into contact with the pads 8a-8d, respectively, the signal transmission with the circuit 2 is performed to determine the operating condition of the circuit 2.</p> |
