| 摘要 |
PURPOSE:To provide flexibility, heat-cycle resistance and pin-hole proofing properties of the electronic parts by adhering epoxy resin powder composition formed by compounding epoxy resin and foaming agent in the specified weight ratio to the electronic parts and then performing heating. CONSTITUTION:Foaming agent of 1-60 wt. pts. to an epoxy resin of 100 wt. pts. is compounded, mixed at a room temperature and crushed to form epoxy resin powder composition. The epoxy resin powder composition thus obtained is adhered to the electronic parts in accordance with the well known methods such as fluidized immersion method, static fluidized immersion method, static fluidized immersion method etc. Thereafter it is hardened by heating. Accordingly, a flexibility, heat-cycle resistance and pin-hole proofing properties can be provided for the electronic component parts.
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