发明名称 OPPOSITE TARGET TYPE SPUTTERING DEVICE
摘要 PURPOSE:To remarkably improve efficiency of a target in a sputtering device oppositely arranged with two pieces of targets by providing a magnetic field generator to the side of the targets and also providing a reflection electrode for repulsing electrons and providing a substrate to be treated to the one side of the targets. CONSTITUTION:A couple of targets T, T' are parallel opposed in a vacuum tank 10 provided with an exhaust system 20 and a gas introducing system 30 and a substrate S to be subjected to sputtering treatment is provided to the side thereof so that it can be moved by the rotation of a roller 42. A magnetic field generator 120 consisting of a core 121 and a permanent magnet 122 is provided to the side of both targets and also a reflection electrode 110 which repulses electrons and is used as a negative electrode is provided to the front face. Since the magnetic field generator 120 is positioned to the side of the targets, cooling plates 103 provided with grooves 103a for passing a refrigerant can be fitted to the bottoms of the targets and cooling thereof is effectively performed and therefore deposition velocity of the sputtered film of target material on the substrate S is remarkably enhanced and also erosion and wastage of the targets are uniformized by the existence of the reflection electrode and the use efficiency of the targets is enhanced.
申请公布号 JPS63270461(A) 申请公布日期 1988.11.08
申请号 JP19870293980 申请日期 1987.11.24
申请人 TEIJIN LTD 发明人 KADOKURA SADAO;HONJO KAZUHIKO;KUSUHARA AKIO
分类号 C23C14/34;C23C14/35;C23C14/56;H01J37/34 主分类号 C23C14/34
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