| 摘要 |
PURPOSE:To contrive improvement in the dampproof property and the mounting density of the title element circuit by a method wherein resin is injected into the space to be formed by bending the part-mounting sub-substrate, to be adjoiningly positioned electrically and mechanically to each side of the main substrate to be used for mounting of parts, at right angle against the main substrate. CONSTITUTION:After the naked semiconductor chip 3, for which a dampproof property is required, has been formed on the main substrate 10, the electrode formed on the semiconductor chip through a wire 4 and the electrode formed on the main substrate 10 are connected by wire bonding. Subsequently, the coating operation of resin 5 is conducted for the purpose of improving the protection and the dampproof property of the naked semiconductor chip, and also to improve the dampproof property of the circuit part for which dampproof property is required. At this point, the flexible substrate 16 performs the function of connecting the main substrate 10 to sub-substrates 12 and 14. As the main substrate and the sub-substrate themselves become the resin- injecting case, a dam is unnecessary, and the precise control over the quantity of resin is also unneccesitated. As a result, this constitution has an excellent workability, and the resin can be coated on the necessary parts in a reliable manner.
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