| 摘要 |
PURPOSE:To contrive an improvement in reliability in mounting of chip parts on the surface by making a warp in a process little, by a method wherein thermosetting resin whose thermal expansion coefficient after cure is limited is provided between a metallic base and copper foil, and a synthetic resin layer which is more flexible than the thermosetting resin is provided between the thermosetting resin layer and metallic base. CONSTITUTION:A material obtained through lamination and curing at the time of molding for unification of a prepreg obtained through impregnation and coating of a mixture composition obtained by compounding powder of an inorganic filling agent with epoxy resin or polyimide resin to glass cloth or polyaramid fiber cloth is appropriate as a thermosetting resin layer 2. Then a thermal expansion coefficient of the thermosetting resin layer is made 15X10<-6>/ deg.C or lower, by making a containing quantity of the inorganic filling agent, an adhesive quantity in the case of the glass cloth and that in the case of the polyaramid fiber cloth respectively 20-40 wt.%, 30-50% and 40-60%. Then butadiene denatured epoxy resin, nitrile rubber denatured phenolic resin are mentioned as synthetic resin 3. Then the synthetic resin layer 3 is unified with a copper foil by interposing the copper foil between the metallic base 4 and thermosetting resin layer 2.
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