| 摘要 |
PURPOSE:To promote automation in a probe apparatus and to improve the working ratio, by performing position alignment between electrode terminals of a semiconductor wafer and a tip part of a probe needle at one prescribed position of the wafer and subsequently moving the wafer in accordance with a predetermined program to measure electrical characteristics. CONSTITUTION:An address of a chip to be positioned by a probe needle 7 is set to be 0, 0. Next, an address of a chip to be measured is designated. Next, position alignment is performed so that a tip pattern of the probe needle 7 is made identical with a tip configuration pattern of an electrode 9. In the case of this position alignment, a wafer 3 is first mounted on a measurement stage 6 and then this stage 6 is moved relatively to the probe needle 7, so that the chip designated in the address 0, 0 is disposed to face the probe needle 7 on a set position. While a microscope 12 or the like is used to observe the probe needle 7 and the electrodes 9 by an operator, the measurement stage 6 is finely moved and adjusted to perform this position alignment exactly. Measurement of electrical characteristics of an IC chip is performed in a continuous automatic process in which the measurement stage 6 is moved relatively to the probe needle 7 in accordance with address designation concerning all chips to be measured.
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