| 摘要 |
PURPOSE:To enable the confirmation and inspection of abnormal shape and position shift in each lead, by receiving only light which is regularly reflected on the tops of bend parts of each lead so as to pick up images of the respective tops and next by using this image signal to compare the position of regular reflection with a prescribed position which is predetermined. CONSTITUTION:Each lead 1a of a semiconductor device 1 is illuminated from its upper side by a parallel flux of light which is parallel radiation light coming from an illumination device 3 through a half mirror 4. Only light 10, which is regularly reflected on the tops of bend parts of each lead 1a, is made to pass through the half mirror 4 and received by a photoelectric conversion device 2. In this photoelectric conversion device 2, only images on upper sides of parts which correspond to the tops of the respective bend parts of each lead 1a are picked up on the basis of a synchronous signal 6 coming from a synchronous signal generation circuit 5c. The pictured image signal 7 is binary-coded, so that regular reflection point images 11 on regular reflection points are stored respectively in an image memory 5d on the basis of a synchronous signal 6. In a central processing unit 5f, the tops of the respective bend perts are detected from the regular reflection point images 11 which are stored in the image memory 5d, and the position of each top is compared with a prescribed position which is predetermined. Each lead 1a can be thus inspected in the amount of its bend and its float.
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