| 摘要 |
PURPOSE:To obtain a high performance thermal head, by evaporating a diamine component and a tetracarboxylic acid component, both of which synthesizes polyamide acid becoming the precursor of a polyimide resin, under vacuum to form polyamide acid to the main surface of a metal substrate and subsequently applying heat-treatment thereto to form a polyimide resin layer on the metal substrate without using an adhesive layer. CONSTITUTION:An active metal layer composed of Cr or Ti is formed to a metal substrate in a predetermined thickness by a vapor deposition method. Thereafter, polyamide acid being the precursor of a polyimide resin is formed on the metal substrate. This polyamide acid is formed using a vacuum vapor deposition apparatus 1 equipped with the vapor deposition source of tetracarboxylic acid and the vapor deposition source 3 of diamine. Thereafter, the metal substrate having polyamide acid thus formed thereto is taken out from the vacuum atmosphere and heated in a nitrogen atmosphere to convert polyamide acid to polyimide to form a polyimide resin layer. Subsequently, a heat generating resistor layer and an electrode layer protecting film are formed on the polyimide resin layer by sputtering to complete a thermal head. |
