COPPER PLATED LAMINATE AND ITS MANUFACTURE

摘要

PURPOSE:To reduce a warp of the title sheet during a reflow process of solder lower a water adsorption rate and improve solderability, by a method wherein a far flexible synthetic res tn layer is provided on the surface of a laminated sheet and the surface is provided with a copper foil unitarily through a thermoplastic resin layer whose thermal expansion coefficient is lower than that of the laminated sheet. CONSTITUTION:One side or both sides oil a laminated sheet obtained by molding a prepreg layer obtained by impregnating a sheetlike base material with thermosetting resin under heating and pressurization are integrated with copper foils, in a copper plated laminated sheet. The laminated sheet 5 and copper foil 8 are integrated by interposing a synthetic resin layer 6 which is more flexible than the laminated sheet 5 and a thermosetting resin layer 7 whose thermal expansion coefficient is lower than that of the laminated sheet 5 in this order from a laminated layer 5 side. Polyvinyl butyral modified phenolic resin and polybutadiene modified epoxy resin are mentioned as can example of the synthetic resin layer material to de used. The thermosetting resin layer whose thermal expansion coefficient is low is a cured layer of a mixture composition obtained by filling epoxy resin to be used for the laminated sheet with an inorganic filling agent or a cured layer of the prepreg obtained by applying the said composition to glass cloth whose thermal expansion coefficient is low through impregnation.