| 摘要 |
PURPOSE:To reduce a time for testing a semiconductor package by a method wherein a semiconductor package heater with an infrared lamp is provided and the infrared radiation emitted by the infrared lamp is condensed by a reflecting plate to heat the semiconductor package to be tested. CONSTITUTION:A semiconductor package 1 is fixed to a heatsink 6 and thermally coupled with it. In this state, the infrared radiation B emitted by an infrared lamp 9 is condensed by a reflecting plate 10 to heat the semiconductor package 1. At that time, the temperature of the semiconductor package 1 is measured by a thermocouple 11 and the output of the infrared lamp 9 is controlled by PID control so as to predetermine the temperature of the semiconductor package 1 at an arbitrary value and the characteristics of the semiconductor package 1 such as light output-current characteristics are measured. With this constitution, unnecessary parts are not heated and the shape of the heatsink can be a shape with a high radiation efficiency so that the temperature characteristics of a number of the semiconductor packages can be measured efficiently in a short time.
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