发明名称 RESINOUS INSULATION SUBSTRATE FOR WIRING CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PURPOSE:To obtain insulation substrates with excellent heat conductivity in the direction of their thickness, by orientating a semicrystalline copolymer to form a sheet and laminating these sheets so that their orientation direction is identical with the thickness direction of the substrate. CONSTITUTION:Desirable resin is formed into an isotropic sheet 10 of a desired thickness by compression molding, and then it is cooled and further auxiliarily heated up to an orientation temperature. An orientated sheet 20 is obtained by performing roll extension of the isotropic sheet 10 at a temperature which is smaller than that on a dissolution transition point of a crystalline material against resin for use. These sheets are cut in rectangular shapes, laminated, and uniformalized in their direction by supersonic welding or the like. This laminate is cut in the direction in which the sheets 20 are orientated, and insulated substrates 30 are formed so that each of them has a width l corresponding to a desired thickness l and besides is provided with a surface 30a, a rear 30b, and a thickness l in order to mount an electric device thereon. Substrates with excellent heat conductivity can be obtained accordingly in the direction of their thickness.
申请公布号 JPS63264828(A) 申请公布日期 1988.11.01
申请号 JP19880076884 申请日期 1988.03.30
申请人 AISIN SEIKI CO LTD 发明人 NEZU SHINJI
分类号 H01B19/00;H01B17/60;H01L23/14;H01L23/373;H05K1/03;H05K1/05;H05K3/00 主分类号 H01B19/00
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