| 发明名称 |
ENCAPSULATED ELECTRONIC COMPONENTS AND ENCAPSULATION COMPOSITIONS |
| 摘要 |
<p>Electronic components are encapsulated with a poly(arylene sulfide) composition containing hydrogenated conjugated diene/monovinylsubstituted aromatic copolymer. The invention also includes certain encapsulation compositions containing poly(arylene sulfide), hydrogenated conjugated diene/monovinyl-substituted aromatic copolymer, reinforcement and filler.</p> |
| 申请公布号 |
CA1244173(A) |
申请公布日期 |
1988.11.01 |
| 申请号 |
CA19830440162 |
申请日期 |
1983.11.01 |
| 申请人 |
PHILLIPS PETROLEUM COMPANY |
发明人 |
BEEVER, WILLIAM H.;SHUE, ROBERT S.;CHILDERS, CLIFFORD W. |
| 分类号 |
B29B7/00;B29C39/00;B29C39/10;B29C45/00;C08J5/24;C08L7/00;C08L9/00;C08L21/00;C08L25/10;C08L53/02;C08L81/00;C08L81/02;H01B3/30;H01C1/034;H01G2/12;H01L23/29;H01L23/31;H05K5/06;(IPC1-7):H01B3/30 |
主分类号 |
B29B7/00 |
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