发明名称 IC PELLET
摘要 <p>PURPOSE:To avoid the break of a pellet at the time of manufacture and improve the yield and the reliability of product by chamfering the corner of the pellet. CONSTITUTION:A pellet 1 wherein the corner 3 is out is obtained by making a V-shape scribing groove 2 at the time of wafer dicing and by rupturing. After the die bonding of the pellet, the bonding pad of the pellet and the electrode of a container are connected with a wire 4. This avoids the break of the pellet because the collision of the collet of a mounter with the corner of the pellet at the time of the die bonding is prevented. Then, at the time of wire bonding, the yield of a product is improved because the interval between the wire and the pellet is made greater and the contact of the wire with corner of the pellet is prevented. Furthermore, a voil or a pin hole is reduced by improving the flow of a resin at the time of transfer molding.</p>
申请公布号 JPS63262834(A) 申请公布日期 1988.10.31
申请号 JP19870097773 申请日期 1987.04.20
申请人 NEC CORP 发明人 NISHIAKI EIJI
分类号 H01L21/301;H01L21/02;H01L21/52;H01L21/78 主分类号 H01L21/301
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