| 摘要 |
PURPOSE:To prevent the breaking of a bump electrode, and to improve reliability by transferring a conductive resin film onto a wiring pattern for a substrate, forming the bump electrode and fixing the joining section of the bump electrode and a semiconductor element with an insulating resin. CONSTITUTION:A conductive resin film 3 is placed onto a substrate 1 with a wiring pattern 2. Only sections to which bumps are shaped are irradiated with laser beams 4. When the film 3 is peeled, a resin is transferred only to the sections as the bumps. A photo-setting type insulating resin 5 is applied onto a section on which a semiconductor chip is loaded, a semiconductor element 6 is contact-bonded, and the resin is cured by irradiation from a lower section of ultraviolet rays. A conductive resin is applied to electrodes on the semiconductor element through the same method, and the bumps are shaped and joined onto the wiring pattern through the same method. Accordingly, the breaking of the electrodes is prevented, thus improving reliability.
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