| 摘要 |
PURPOSE:To cope with complicated arrangement while solving such a problem as probe slide by a method wherein a conductive patterns are formed on an insulating substrate to form bumps to be brought into contact with a bonding pad to be measured on the conductive patterns. CONSTITUTION:Conductive patterns 4 are laid on the surface of an insulating substrate 2 to form bumps 7 to be brought into contact with a bonding pad as an object of measurement on the conductive patterns 4. In such a constitution, such a problem as probe slide can be solved by the adoption of conductive patterns 4; the contact of conductive patterns 4 with bonding pad can be assured by bumps 7; and the probe card can cope with complicated arrangement by making the substrate 2 both surfaced or multilayered.
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