| 摘要 |
<p>PURPOSE:To make cracks, which are generated upon the mounting on a printed circuit board limited to a lattice part and to interrupt the outward proceeding of cracks so as to prevent the resin cracks, by forming a thin film with a lattice-shaped net pattern ranging from a lower side or an upper side of a semiconductor element mounting part to its lower resin part. CONSTITUTION:A semiconductor element 1 is mounted by the use of silver paste on a die pad 2 which is covered with a lattice-shaped net pattern thin plate 7 made of glass epoxy resin fiber. The lattice-shaped net pattern thin plate 7 is disposed to be hung downward from the die pad 2 after wire bonding. Thereafter the semiconductor element 1 is sealed by a resinous sealing material 6 made of epoxy resin. Since most resin cracks are generated from end sides of the die pad 2 upon the mounting on a printed circuit board, concentration of stress can be relaxed by covering the die pad 2 end sides with the lattice- shaped net pattern thin plate 7 or otherwise the generation of cracks can be limited at only a space between the die pad 2 and the lattice-shaped net pattern thin plate 7.</p> |
