| 摘要 |
PURPOSE:To prevent pitches of wiring leads from being shifted in a semiconductor device which has a plurality of wirings being small in width and in pitches between wirings, by forming the wiring leads on a flexible tape-shaped film and collectively connecting a semiconductor chip with the leads and next performing resin sealing for them. CONSTITUTION:A copper foil of about 30mum in thickness is stuck on a peripheral rear side of a cut-out part 3 of heat-resisting carrier tape 1 which has the cut-out part 3 in an mounting region of a semiconductor chip 6 to be mounted, and a photoetching method or the like is used to form this copper foil into any necessary wiring lead 2 of a pattern of e.g., 100mum or so in width. In succession, a semiconductor chip 6 is stuck on the rear side of the cut-out part 3 of the carrier tape 1, and wiring connections of the wiring leads 2 to electrode pads of the semiconductor chip 6 are collectively performed by a bump method or the like. Next, resin in a plastic mold molding method is used to perform dielectric sealing of the semiconductor chip 6 including part of the wiring leads 2. Pitches of leads can be hence prevented from being shifted.
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