| 摘要 |
PURPOSE:To simplify a production process and to reduce the production cost by a method wherein two or more memory semiconductor devices are plastic- sealed simultaneously. CONSTITUTION:Two or more memory semiconductor devices 1 are mounted on a printed-circuit board; a wiring operation to the circuit board is executed; they are mounted on a lead frame; the wiring operation to the lead frame is executed; then, in order to cover the whole assembly, the lead frame is plastic-sealed by an injection molding method; the whole assembly is covered with a thick resin part 6. Lastly, leads 5 are plated; the leads 5 are formed like a single line arranged in a straight line; a package is completed. By this setup, a plastic sealing operation can be executed after the two or more memory semiconductor devices have been mounted simultaneously and the devices have been connected to the leads; a production process can be simplified and a high- density mounting operation or the like can be realized.
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