| 摘要 |
PURPOSE:To stabilize a wire loop and to prevent a short circuit at an edge and a bend by moving a capillary in such a way that the tension is exerted on the wire loop just before a bonding point. CONSTITUTION:After a capillary 4 has bonded a wire 2 to a first bonding point a, it is lifted, passes through a highest rise point b and then descends; the capillary 4 stops descending once at a prior point c and is shifted horizontally to an upper point d; after that, it descends again and bonds the wire 2 to a second bonding point e. If the capillary 4 is shifted according to this locus, the tension is exerted on a wire loop 7; a curved point on the side of the capillary 4 is shifted from A to B; accordingly, it is possible to prevent a short circuit at an edge irrespective of a bonding distance and a type of a semiconductor device. |
