| 摘要 |
PURPOSE:To prevent the yield of resistering aligner from decreasing due to the exfoliation of a film having wrong bondability from the base of a region not formed with a semiconductor element by providing an optical system for exposing part the surface of a semiconductor substrate, and a semiconductor substrate supporting stage for selectively split exposing the surface of the substrate in addition to an optical system for printing and exposing a semiconductor element pattern. CONSTITUTION:In a resistering aligner for printing and exposing a predetermined pattern on a semiconductor substrate 5 coated with a photoresist, optical systems 1-4 for wholly exposing part of the surface of the substrate 5, and a semiconductor substrate supporting stage 6 for selectively split exposing the surface of the substrate 5 are provided in addition to optical systems 9-12 for printing and exposing a semiconductor element pattern. For example, an ultraviolet ray condensed by a lens 1 is transferred via an optical fiber 2, the ray shaped by a blind 3 is selectively exposed at the periphery of the substrate 5 by a semiconductor supporting stage 6 through the lens 4.
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