| 摘要 |
PURPOSE:To prevent a crack in a ceramic substrate by fixing a metal stud on a metal base back through a ceramic plate of the same material with the ceramic substrate or having a near thermal expansion factor. CONSTITUTION:When electric power is supplied from outside through a lead and a thin wire to a semiconductor element 5, a part is taken outside as a signal and the rest is emitted from the semiconductor element 5 as heat. This heat is radiated to an external radiating body through a solder 6, a ceramic substrate 3, a wax material 4 and a base 1. Since at this time the base 1 is composed of a metal having good thermal conductivity such as copper, good thermal conductivity can be secured. As the ceramic substrate 3 and a ceramic plate 7 having equal thermal expansion factors are stuck to the surface side and the back side of the base 1, each member composing this device is hard to bend even when a semiconductor device is held at a low temperature and accordingly the stress to be generated to the semiconductor element 5 and the ceramic substrate 3 is reduced so that these are hard to break. |
