| 发明名称 |
SUBSTRATE FOR SEMICONDUCTOR MODULE |
| 摘要 |
In a method of manufacturing a substrate suitable for receiving a semiconductor module, a sheet of copper is disposed on a surface of a ceramic plate, the plate and sheet are heated together at a temperature in the range 1065 - 1083 DEG C to bond the copper and ceramic together and parts of the copper sheet are etched away to leave a copper sheet of predetermined shape on the surface of the ceramic plate. |
| 申请公布号 |
DE3378009(D1) |
申请公布日期 |
1988.10.20 |
| 申请号 |
DE19833378009 |
申请日期 |
1983.12.20 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MIZUNOYA, NOBUYUKI C/O PATENT DIVISION;KOHAMA, HAJIME C/O PATENT DIVISION;SUGIURA, YASUYUKI C/O PATENT DIVISION |
| 分类号 |
H01L23/12;C04B41/88;H01L21/48;H01L21/52;H01L23/15;H05K1/03;H05K3/38;(IPC1-7):H05K3/02;H01L23/14 |
主分类号 |
H01L23/12 |
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