MATERIAL FOR CERAMIC WIRING SUBSTRATE AND MANUFACTURE THEREOF

摘要

A blank material for use as a ceramic wiring substrate of this invention is prepared by laminating a copper foil onto a ceramic base formed from a boron nitride sintered body or the like via a bonding layer interposed therebetween, and incoporating an inorganic filler in at least the ceramic base-containing side of the bonding layer. A fine and high density circuit substrate can be easily formed from the ceramic wiring substrate blank material according to the present invention by a conventional etching method.