| 摘要 |
PURPOSE:To make the title device strong enough to withstand large power consumption sufficiently by fast sticking a heat sink onto the reverse surface of a bump bonded surface in a chip and remarkably lowering the thermal resistance of the semiconductor chip. CONSTITUTION:A solder bump is formed onto one surface of a semiconductor chip 1, and a heat sink 4 having various shapes made of an alloy such as the alloy of copper and tungsten is fixed extending over the whole surface of the reverse surface of one surface of the chip 1. The quantity of heat generated from the chip 1 is thermally conducted directly to a heat-sink fin 40, 41 or 42 for the heat sink 4, and dissipated into an atmosphere through the heat-sink fin, thus largely lowering the thermal resistance of the chip 1. Accordingly, a semiconductor device is strong enough to withstand large power consumption.
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