| 摘要 |
PURPOSE:To obtain a uniform film thickness by dripping a resist on a wafer with a weak shock by a method wherein a resist reservoir and a valve are inserted in a resist-supply pipe connecting a pump with a nozzle and a dripping speed of the resist is made low regardless of the discharge pressure of the pump. CONSTITUTION:A resist reservoir 13 and a valve 14 are separately inserted in a second resist-supply pipe leading from a pump 5 to a nozzle 8. A resist which has been discharged from the pump 5 via a valve 7 is once stored in the resist reservoir 13. If the valve 14 is opened and closed synchronously with the timing of a process, the resist stored in the resist reservoir 13 is dripped freely on a wafer 9 via the nozzle 8. By this setup, a resist 12 to be dripped falls at an always constant and at low speed without possessing an initial velocity due to a discharge pressure of the pump.
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