发明名称 ION BEAM SPUTTERING DEVICE
摘要 PURPOSE:To enable high-speed and large-area treatment, by arranging plural targets releasing sputtering grains by means of irradiation from an ion source into a shape of an inclined plane of a circular cone, etc., standing on the ion- source side as a base so as to converge the above-mentioned grains. CONSTITUTION:This ion beam sputtering device is composed of an ion source 1 producing plasma, a vacuum vessel 6 fitted to the above in a state held airtight, targets 7, and a substrate 8 on which a film is formed by means of the grains released from the targets 7. The above targets 7 release the grains sputtered by the irradiation of an ion beam from the ion source 1, and moreover, plural targets 7 are arranged so that they form a part of the inclined plane of a circular cone, etc., standing on the above-mentioned ion-source 1 side as a base.
申请公布号 JPS63247367(A) 申请公布日期 1988.10.14
申请号 JP19870080963 申请日期 1987.04.03
申请人 HITACHI LTD 发明人 ONO YASUNORI;HAKAMATA YOSHIMI;NATSUI KENICHI;NAKAGAWA YUKIO;SATO TADASHI
分类号 C23C14/46;C23C14/50 主分类号 C23C14/46
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