| 摘要 |
PURPOSE:To prevent corrosion of Al provided on a wafer, by disposing a wafer takeout part, which is interrupted from the air, to be coupled with an etching chamber and partitioning the takeout part and the etching chamber through opening/closing doors which are disposed therebetween to hold an air an liquid tight state and further equipping the wafer takeout part with a processing part where posttreatment is performed for the etched wafer. CONSTITUTION:Opening/closing doors 6, 7 for holding an air and liquid tight state, and valves 10 to 12 are closed, and a valve 13 is opened, and a vacuum device 8 is used to hold a wafer takeout part 2 in advance on the same vacuum state as in an etching chamber 1 where a high melting point metal such as Al and a serial layer of its metal compound are dry-etched. Upon the completion of carrying the wafer, the opening/closing door 6 for holding the air and liquid tight state is closed and also the value 13 is closed. In succession the valve 11 is opened to introduce a dry nitrogen gas from a gas tank 5, and next the valve 11 is closed. Thereafter the valve 10 is opened to introduce pure wafer so that the wafer takeout part is filled with this pure water, and next the valve 10 is closed. During these processes, remaining gases (CCl4, BCl3, etc.) contained in a photoresist are rinsed off by a large quantity of the pure water and completely removed, and so Al or Al alloy can be prevented from being corroded.
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