| 摘要 |
PURPOSE:To obtain the title composition excellent in workability of soldering to a terminal of a small area, applicability to the surface of a metal substrate, etc. and remarkably small in abrasion loss of a press mold, by mixing an epoxy resin with a curing agent and a specified amount of calcined kaolin clay. CONSTITUTION:The title composition is obtained by mixing an epoxy resin (a) having at least two epoxy bonds in the molecule (e.g., bisphenol A epoxy resin) with a curing agent (b) (e.g., amine), 20-80wt.%, preferably, 30-60wt.%, calcined clay (c) of an ignition loss <=1.0wt.%, a max. particle diameter of several tens of mum or less and an average particle diameter of several mum and, optionally, a coupling agent, an antifoamer, a colorant, etc. Said composition is applied to at least one surface of a metal substrate 2 to form an insulating layer 3 of a thickness of 50-200mum, and a metal foil 4 for constituting a terminal or circuit of a heat-emitting element or circuit component is adhesively attached to the insulating layer 3 to obtain an insulated metal substrate 1. |
